Invention Grant
- Patent Title: Light emitting device package for temeperature detection
- Patent Title (中): 用于温度检测的发光器件封装
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Application No.: US12395756Application Date: 2009-03-02
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Publication No.: US08093788B2Publication Date: 2012-01-10
- Inventor: Shan Mei Wan , Chi Hang Cheung , Ming Lu
- Applicant: Shan Mei Wan , Chi Hang Cheung , Ming Lu
- Applicant Address: CN Hong Kong
- Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Brooks Kushman P.C.
- Main IPC: H01J7/24
- IPC: H01J7/24

Abstract:
A light emitting device package and a lighting system are provided. According to one embodiment, a functional substrate; at least one light emitting element bonded onto the functional substrate; and at least one design-in thermal detection unit built onto the functional substrate are provided, wherein the design-in thermal detection unit is proximate to the light emitting element, and wherein the design-in thermal detection unit is configured to detect the temperature and transmit a temperature signal. The design-in thermal detection unit may be an NTC thermistor based on a semiconductor substrate. A control system may be included to detect temperature and make any necessary current adjustments in order to maintain consistent performance of the light emitting element.
Public/Granted literature
- US20100219733A1 LIGHT EMITTING DEVICE PACKAGE FOR TEMEPERATURE DETECTION Public/Granted day:2010-09-02
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