Invention Grant
US08093726B2 Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same
有权
具有中介层的半导体封装，采用该半导体封装的电子产品及其制造方法
- Patent Title: Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same
- Patent Title (中): 具有中介层的半导体封装，采用该半导体封装的电子产品及其制造方法
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Application No.: US12286656Application Date: 2008-10-01
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Publication No.: US08093726B2Publication Date: 2012-01-10
- Inventor: Sung-Yong Park
- Applicant: Sung-Yong Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2007-0099422 20071002
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package and methods for manufacturing the same are provided. The semiconductor package includes a substrate, first and second semiconductor chips stacked on the substrate. An interposer is disposed between the first and second semiconductor chips. The interposer has a non-planar top surface.
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