Invention Grant
- Patent Title: System and method for RF shielding of a semiconductor package
- Patent Title (中): 一种用于半导体封装RF屏蔽的系统和方法
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Application No.: US12502409Application Date: 2009-07-14
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Publication No.: US08093691B1Publication Date: 2012-01-10
- Inventor: Ruben Fuentes , Christopher Scanlan , Jong Chun
- Applicant: Ruben Fuentes , Christopher Scanlan , Jong Chun
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Weiss & Moy, P.C.
- Agent Jeffrey D. Moy
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/52 ; H01L293/40 ; H01L23/48 ; H01L23/28
Abstract:
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.
Information query
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