Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12467479Application Date: 2009-05-18
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Publication No.: US08093665B2Publication Date: 2012-01-10
- Inventor: I-Chen Yang , Guan-Wei Wu , Yao-Wen Chang , Tao-Cheng Lu
- Applicant: I-Chen Yang , Guan-Wei Wu , Yao-Wen Chang , Tao-Cheng Lu
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94

Abstract:
A semiconductor device is described, which includes a substrate, a gate structure, doped regions and lightly doped regions. The substrate has a stepped upper surface, which includes a first surface, a second surface and a third surface. The second surface is lower than the first surface. The third surface connects the first surface and the second surface. The gate structure is disposed on the first surface. The doped regions are configured in the substrate at both sides of the gate structure and under the second surface. The lightly doped regions are configured in the substrate between the gate structure and the doped regions, respectively. Each lightly doped region includes a first part and a second part connecting with each other. The first part is disposed under the second surface, and the second part is disposed under the third surface.
Public/Granted literature
- US20100289093A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-11-18
Information query
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