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US08089622B2 Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers 有权
用于评估晶片边缘区域中的缺陷并在晶片检查系统中使用该装置的装置和方法

Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers
Abstract:
A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).
Abstract(Chinese):

公开了一种用于评估晶片（6）的边缘区域中的缺陷的装置。 评价也可以自动进行。 特别地，该装置包括三个相机（25,26,27），每个相机设置有物镜（30），其中第一相机（25）布置成使得第一相机（25）与第一相机 晶片（6）的上表面（6a），其中第二相机（26）布置成使得第二相机（26）与晶片（6）的前表面（6b）相对，并且其中第三相机 （27）被布置成使得第三相机（27）与晶片（6）的下表面（6c）上的边缘区域相对。

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