Invention Grant
- Patent Title: System and method for enhancing light emissions from light packages by adjusting the index of refraction at the surface of the encapsulation material
- Patent Title (中): 通过调节封装材料表面的折射率来增强光封装的光发射的系统和方法
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Application No.: US11403266Application Date: 2006-04-13
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Publication No.: US08089083B2Publication Date: 2012-01-03
- Inventor: Janet Bee Yin Chua
- Applicant: Janet Bee Yin Chua
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Light emission from a light package, such as from an LED light package, is enhanced by a system and method for adjusting the refractive index at the surface of the encapsulating material surrounding the light source. The surface refractive index is changed to better match the index within the encapsulating material with the index of the media surrounding the encapsulating material. In one embodiment, the index is adjusted by roughing the surface of the encapsulating material. In another embodiment, a separate layer is created having a corrective index of refraction. The separate layer can comprise photonic crystals, if desired. In some embodiments the adjusting will achieve a graded index of refraction.
Public/Granted literature
Information query
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