Invention Grant
US08088680B2 Method for fabricating integrated circuit having at least three linear-shaped gate electrode level conductive features of equal length positioned side-by-side at equal pitch
有权
一种用于制造集成电路的方法,该集成电路具有至少三个相等长度并排定位的线形栅电极层导电特征
- Patent Title: Method for fabricating integrated circuit having at least three linear-shaped gate electrode level conductive features of equal length positioned side-by-side at equal pitch
- Patent Title (中): 一种用于制造集成电路的方法,该集成电路具有至少三个相等长度并排定位的线形栅电极层导电特征
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Application No.: US12572091Application Date: 2009-10-01
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Publication No.: US08088680B2Publication Date: 2012-01-03
- Inventor: Scott T. Becker , Michael C. Smayling
- Applicant: Scott T. Becker , Michael C. Smayling
- Applicant Address: US CA Los Gatos
- Assignee: Tela Innovations, Inc.
- Current Assignee: Tela Innovations, Inc.
- Current Assignee Address: US CA Los Gatos
- Agency: Martine Penilla Group, LLP
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A cell layout of a semiconductor device includes a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions. The cell layout also includes a gate electrode level layout defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the cell.
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