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US08088662B2 Fabrication method of trenched metal-oxide-semiconductor device 失效
沟槽金属氧化物半导体器件的制造方法

Fabrication method of trenched metal-oxide-semiconductor device
Abstract:
A fabrication method of a trenched metal-oxide-semiconductor device is provided. Firstly, an epitaxial layer is formed on a substrate. Then, a plurality of gate trenches is formed in the epitaxial layer. Afterward, a spacer is formed on the sidewall of the trench gates. The spacer is utilized as a mask to selectively implant oxygen ion into the bottom of the gate trenches so as to form a bottom oxide layer on the bottom of the gate trenches to reduce capacitance between gate and drain.
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