Invention Grant
- Patent Title: Fabrication method of trenched metal-oxide-semiconductor device
- Patent Title (中): 沟槽金属氧化物半导体器件的制造方法
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Application No.: US13149812Application Date: 2011-05-31
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Publication No.: US08088662B2Publication Date: 2012-01-03
- Inventor: Chun Ying Yeh
- Applicant: Chun Ying Yeh
- Applicant Address: TW Taipei
- Assignee: Niko Semiconductor Co., Ltd.
- Current Assignee: Niko Semiconductor Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW97148359A 20081212
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A fabrication method of a trenched metal-oxide-semiconductor device is provided. Firstly, an epitaxial layer is formed on a substrate. Then, a plurality of gate trenches is formed in the epitaxial layer. Afterward, a spacer is formed on the sidewall of the trench gates. The spacer is utilized as a mask to selectively implant oxygen ion into the bottom of the gate trenches so as to form a bottom oxide layer on the bottom of the gate trenches to reduce capacitance between gate and drain.
Public/Granted literature
- US20110230025A1 FABRICATION METHOD OF TRENCHED METAL-OXIDE-SEMICONDUCTOR DEVICE Public/Granted day:2011-09-22
Information query
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