A method, including; simultaneously forming a first doped region of an electrostatic discharge protection device and a second doped region of a high-power device by performing a first ion implantation into a semiconductor substrate; and simultaneously forming a third doped region of the electrostatic discharge protection device and a fourth doped region of a first low power device by performing a second ion implantation into the semiconductor substrate, the first ion implantation different from the second ion implantation, the electrostatic discharge device being a different device type from the high-power device and the electrostatic discharge device having a different structure from the high-power device.