Invention Grant
- Patent Title: Implant delivery system
- Patent Title (中): 植入物输送系统
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Application No.: US12074124Application Date: 2008-02-28
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Publication No.: US08087935B2Publication Date: 2012-01-03
- Inventor: Keith D. Beaty , Richard J. Lazzara , Daniel J. Tarullo , Thomas S. Heylmun
- Applicant: Keith D. Beaty , Richard J. Lazzara , Daniel J. Tarullo , Thomas S. Heylmun
- Applicant Address: US FL Palm Beach Gardens
- Assignee: Biomet 3i, LLC
- Current Assignee: Biomet 3i, LLC
- Current Assignee Address: US FL Palm Beach Gardens
- Agency: Nixon Peabody LLP
- Main IPC: A61C3/00
- IPC: A61C3/00 ; A61C8/00

Abstract:
An implant delivery system includes a carrier that is attached to an implant. The carrier includes a main body having a lower portion to be attached to the implant and an upper portion. The upper portion includes an internally threaded section having a polygonal internal cross-section. The polygonal cross-section engages a tool that applies torque to install the implant into bone. The threaded section receives a threaded portion of a secondary component to be coupled to the carrier after the implant has been installed. One secondary component is a gingival healing component. Thus, the combination of the carrier and the gingival healing component acts as a healing abutment after the carrier has been used to install the implant.
Public/Granted literature
- US20080153062A1 Implant delivery system Public/Granted day:2008-06-26
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