The invention relates to a cooling apparatus for an electric component such as a CPU, a memory or power semiconductor, such as transistors or LEDs, or a processor. The cooling apparatus comprises a heatsink, an impeller that coaxially encloses the heatsink, and a drive motor for the impeller. The heatsink takes the form of a stationary hub having a base for introducing heat from the electronic component that is to be cooled, the hub widening towards the base. Cooling fins are thermally coupled to the hub, the cooling fins being given a spiral-like curve similar to the blades of the impeller. Due to the special design of the hub and the cooling fins as well as the use of a radial flux motor, a highly efficient, particularly compact cooling apparatus can be realized.