Invention Grant
- Patent Title: System for printing 3D semiconductor products
- Patent Title (中): 3D半导体产品印刷系统
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Application No.: US12765702Application Date: 2010-04-22
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Publication No.: US08087755B2Publication Date: 2012-01-03
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Priority: AU2003900180 20030116
- Main IPC: B41J2/04
- IPC: B41J2/04

Abstract:
A system for printing three-dimensional semiconductor products. The system includes printheads for printing various so as to create a three-dimensional structure including cavities, and a robot for incorporating semiconductor objects into the cavities created during the printing process. The robot incorporates the semiconductor objects into the cavities during printing of the three-dimensional structure.
Public/Granted literature
- US20100200167A1 SYSTEM FOR PRINTING 3D SEMICONDUCTOR PRODUCTS Public/Granted day:2010-08-12
Information query
IPC分类: