Invention Grant
- Patent Title: Component connecting structure
- Patent Title (中): 组件连接结构
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Application No.: US12105958Application Date: 2008-04-18
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Publication No.: US08087703B2Publication Date: 2012-01-03
- Inventor: Yasushi Kumakawa
- Applicant: Yasushi Kumakawa
- Applicant Address: JP Yokohama-shi
- Assignee: Piolax Inc.
- Current Assignee: Piolax Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-111770 20070420; JP2007-200967 20070801
- Main IPC: F16L23/00
- IPC: F16L23/00

Abstract:
A component connecting structure includes a first component having a flange portion, a second component having a flange portion, and a clip for holding the flange portions in a butted state. The clip formed into a generally polygonal shape has a spring body having first and second circumferential end portions overlapped with each other in a diameter reduced free state. The spring body has slits for inserting the flange portions butted against each other in the diameter reduced free state. The first and second circumferential end portions have a temporary engaging protrusion and a temporary engaging ledge, respectively. The temporary engaging ledge is engaged with the temporary engaging protrusion to hold a diameter expanded state of the spring body.
Public/Granted literature
- US20080258462A1 COMPONENT CONNECTING STRUCTURE Public/Granted day:2008-10-23
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