Invention Grant
US08087427B2 Vapor phase epitaxy apparatus and irregular gas mixture avoidance method for use therewith 有权
气相外延装置和不规则气体混合物回避方法

Vapor phase epitaxy apparatus and irregular gas mixture avoidance method for use therewith
Abstract:
A vapor phase epitaxy apparatus having a processing chamber with a target workpiece such as a wafer being received therein is disclosed. This apparatus includes a first flow path which supplies the chamber with a gas needed for vapor phase epitaxial film formation on the wafer, and a valve unit for controlling the gas flow in the first flow path. The apparatus also includes a second flow path for supplying into the chamber a cleaner gas for cleaning of the interior of the chamber, and a third flow path for exhaust of residual gases within the chamber. The valve unit has a series combination of two-stage valves with a pressure switch being provided therebetween. An irregular gas mixture avoiding method for use with the apparatus is also disclosed.
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