Invention Grant
- Patent Title: Vapor phase epitaxy apparatus and irregular gas mixture avoidance method for use therewith
- Patent Title (中): 气相外延装置和不规则气体混合物回避方法
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Application No.: US11276493Application Date: 2006-03-02
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Publication No.: US08087427B2Publication Date: 2012-01-03
- Inventor: Kunihiko Suzuki , Hideki Ito
- Applicant: Kunihiko Suzuki , Hideki Ito
- Applicant Address: JP Numazu-shi
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Numazu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-061122 20050304; JP2006-041885 20060220
- Main IPC: F16K31/12
- IPC: F16K31/12 ; F16K31/36 ; F16K17/26 ; F16K24/00 ; C23C16/00

Abstract:
A vapor phase epitaxy apparatus having a processing chamber with a target workpiece such as a wafer being received therein is disclosed. This apparatus includes a first flow path which supplies the chamber with a gas needed for vapor phase epitaxial film formation on the wafer, and a valve unit for controlling the gas flow in the first flow path. The apparatus also includes a second flow path for supplying into the chamber a cleaner gas for cleaning of the interior of the chamber, and a third flow path for exhaust of residual gases within the chamber. The valve unit has a series combination of two-stage valves with a pressure switch being provided therebetween. An irregular gas mixture avoiding method for use with the apparatus is also disclosed.
Public/Granted literature
- US20060196411A1 VAPOR PHASE EPITAXY APPARATUS AND IRREGULAR GAS MIXTURE AVOIDANCE METHOD FOR USE THEREWITH Public/Granted day:2006-09-07
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