Invention Grant
- Patent Title: Network on chip with low latency, high bandwidth application messaging interconnects that abstract hardware inter-thread data communications into an architected state of a processor
- Patent Title (中): 具有低延迟,高带宽应用程序消息互连的片上网络,将硬件线程间数据通信抽象为处理器的架构状态
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Application No.: US12118272Application Date: 2008-05-09
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Publication No.: US07991978B2Publication Date: 2011-08-02
- Inventor: Jamie R. Kuesel , Mark G. Kupferschmidt , Eric O. Mejdrich , Paul E. Schardt
- Applicant: Jamie R. Kuesel , Mark G. Kupferschmidt , Eric O. Mejdrich , Paul E. Schardt
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Biggers & Ohanian, LLP
- Main IPC: G06F15/00
- IPC: G06F15/00 ; G06F15/76

Abstract:
Data processing on a network on chip (‘NOC’) that includes integrated processor (‘IP’) blocks, each of a plurality of the IP blocks including at least one computer processor, each such computer processor implementing a plurality of hardware threads of execution; low latency, high bandwidth application messaging interconnects; memory communications controllers; network interface controllers; and routers; each of the IP blocks adapted to a router through a separate one of the low latency, high bandwidth application messaging interconnects, a separate one of the memory communications controllers, and a separate one of the network interface controllers; each application messaging interconnect abstracting into an architected state of each processor, for manipulation by computer programs executing on the processor, hardware inter-thread communications among the hardware threads of execution; each memory communications controller controlling communication between an IP block and memory; each network interface controller controlling inter-IP block communications through routers.
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