Invention Grant
- Patent Title: Method and apparatus for indirectly simulating a semiconductor integrated circuit
- Patent Title (中): 用于间接模拟半导体集成电路的方法和装置
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Application No.: US11888535Application Date: 2007-08-01
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Publication No.: US07991604B2Publication Date: 2011-08-02
- Inventor: Jae-Hoon Lee
- Applicant: Jae-Hoon Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2006-0075951 20060811
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method and an apparatus for indirectly simulating a semiconductor integrated circuit (IC) are described. A circle chain is formed using input pins and output pins to provide an intellectual property (IP) core model that substitutes for a real IP core circuit. A test bench for the IP core model is generated, the semiconductor IC that includes the IP core model is integrated using the generated test bench, and the semiconductor IC is simulated.
Public/Granted literature
- US20090216512A9 Method and apparatus for indirectly simulating a semiconductor integrated circuit Public/Granted day:2009-08-27
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