Invention Grant
- Patent Title: Optical package with multi-component mounting frame
- Patent Title (中): 带多部件安装架的光学包装
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Application No.: US12419550Application Date: 2009-04-07
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Publication No.: US07991254B2Publication Date: 2011-08-02
- Inventor: Jacques Gollier
- Applicant: Jacques Gollier
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kwadjo Adusei-Poku
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B26/00 ; G02F1/01

Abstract:
An optical package is provided comprising a laser diode, coupling optics, a wavelength conversion device, and a multi-component mounting frame. The coupling optics comprises a first lens component that creates a virtual magnified image V of the waveguide of one of the opposing facets with a magnification factor M1 and a second lens component that creates a focused image of V at the remaining opposing facet with a magnification factor M2. The virtual magnified image V is outside of the interfacial waveguide-to-waveguide optical path of the package and the multi-component mounting frame comprises first and second frame components that independently fix the relative alignment of the first and second lens components. The first and second frame components are secured to each other such that angular misalignment between the first and second frame components originates along a fixation interface H that is outside of the interfacial waveguide-to-waveguide optical path. The virtual magnified image V and the fixation interface H are both positioned on a common side of the coupling optics, either the laser diode side of the coupling optics or the wavelength conversion device side of the coupling optics. Additional embodiments are disclosed and claimed.
Public/Granted literature
- US20100254654A1 Optical Package With Multi-Component Mounting Frame Public/Granted day:2010-10-07
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