Invention Grant
- Patent Title: Electronic system with heat dissipation structure
- Patent Title (中): 具有散热结构的电子系统
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Application No.: US12614452Application Date: 2009-11-09
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Publication No.: US07990720B2Publication Date: 2011-08-02
- Inventor: Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
- Applicant: Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Frank R. Niranjan
- Priority: CN200910302933 20090604
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.
Public/Granted literature
- US20100309626A1 ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE Public/Granted day:2010-12-09
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