A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom for in contact with the electronic component. The wire clip includes a middle part spanning over the heat sink and two latching legs extending oppositely from two opposite ends of the middle part, respectively, the two latching legs being located in front of and in rear of the heat sink, respectively. Each operating member includes a plate cam placed on the heat sink and a handle extending laterally from the plate cam. The middle part of the wire clip extends through the plate cams and can be lifted away from the heat sink by turning the operating members from an unlocking state to a locking state.