Invention Grant
- Patent Title: Heat sink structure and test head with same
- Patent Title (中): 散热器结构和测试头相同
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Application No.: US12333392Application Date: 2008-12-12
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Publication No.: US07990716B2Publication Date: 2011-08-02
- Inventor: Koei Nishiura
- Applicant: Koei Nishiura
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G01R31/02
Abstract:
A heat sink structure having an improved heat radiation efficiency is disclosed. The heat sink structure comprises a plate-shaped heat sink having a top surface and a bottom surface, wherein through holes along a planar direction of a board are formed between the top surface and the bottom surface of the heat sink.
Public/Granted literature
- US20100148792A1 HEAT SINK STRUCTURE AND TEST HEAD WITH SAME Public/Granted day:2010-06-17
Information query
