Invention Grant
- Patent Title: Heat dissipation device and fasteners thereof
- Patent Title (中): 散热装置及其紧固件
-
Application No.: US12510227Application Date: 2009-07-27
-
Publication No.: US07990714B2Publication Date: 2011-08-02
- Inventor: Jian Yang
- Applicant: Jian Yang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Frank R. Niranjan
- Priority: CN200910301281 20090401
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34 ; F16B37/02
Abstract:
A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate and pressing an end of the heat pipe to the heat absorbing plate, and a plurality of fasteners extending through the pressing plate to secure the end of the heat pipe, the heat absorbing plate and the pressing plate to a printed circuit board. Each of the fasteners includes a connecting portion extending through the pressing plate, a first operating portion extending from the connecting portion, and a second operating portion formed at an end face of the first operating portion. The first and second operating portions are configured to be operated by different tools.
Public/Granted literature
- US20100254083A1 HEAT DISSIPATION DEVICE AND FASTENERS THEREOF Public/Granted day:2010-10-07
Information query
