Density-conforming vertical plate capacitors exhibiting enhanced capacitance and methods for fabricating density-conforming vertical plate capacitors exhibiting enhanced capacitance are provided. An embodiment of the density-conforming vertical plate capacitor comprises a first conductive interconnect and a second conductive interconnect. The second conductive interconnect overlies the first conductive interconnect and is substantially aligned with the first conductive interconnect. A via bar electrically couples the first conductive interconnect and the second conductive interconnect. The via bar has a width and a length that is larger than the width and contributes to the capacitance of the vertical plate capacitor.