As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser operation, a mark is formed at the surface of the substrate within the marking area. The mark contrasts strongly with the reflective surface of the substrate in the marking area. As a result, the mark may be read with an optoelectronic imaging system with a higher rate of reliability than marks disposed at a substrate surface having a microtopographical profile with greater variation from a nominal surface plane. An IHS with a mark so disposed provides benefits when include as a portion of an integrated circuit package, which in turn provides benefits when included as a portion of an electronic system.