Invention Grant
- Patent Title: Bonding pad for preventing pad peeling
- Patent Title (中): 粘接垫，用于防止垫剥落
-
Application No.: US12897623Application Date: 2010-10-04
-
Publication No.: US07989962B2Publication Date: 2011-08-02
- Inventor: Jeong-Soo Kim
- Applicant: Jeong-Soo Kim
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2007-0070557 20070713
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A bonding pad includes multiple metal layers, insulation layers disposed between the multiple metal layers, and a fixing pin coupled between the uppermost metal layer and an underlying metal layer of the multiple metal layers, where a bonding is performed on the uppermost metal layers.
Public/Granted literature
- US20110018131A1 BONDING PAD FOR PREVENTING PAD PEELING Public/Granted day:2011-01-27
Information query
IPC分类:
