Invention Grant
- Patent Title: Package structure and manufacturing method thereof
- Patent Title (中): 包装结构及其制造方法
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Application No.: US11647299Application Date: 2006-12-29
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Publication No.: US07989937B2Publication Date: 2011-08-02
- Inventor: Gwo-Liang Weng
- Applicant: Gwo-Liang Weng
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Rabin & Berdo, P.C.
- Priority: TW95109936A 20060322
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a chip and a packing material layer. The substrate has a top surface and a lateral surface. The top surface is connected with the lateral surface. The chip is disposed on the top surface. The packing material layer comprises a body portion and an extending portion. The body portion covers at least a part of the chip and the substrate. The extending portion is connected with the body portion and covers at least a part of the substrate. The extending portion is projected to the lateral surface and made from a transparent material.
Public/Granted literature
- US20070222049A1 Package structure and manufacturing method thereof Public/Granted day:2007-09-27
Information query
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