Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12323573Application Date: 2008-11-26
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Publication No.: US07989897B2Publication Date: 2011-08-02
- Inventor: Noriaki Maeda
- Applicant: Noriaki Maeda
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2008-020080 20080131
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A semiconductor device includes a first MISFET and a second MISFET which are formed over a semiconductor substrate and have the same conductive type. The first MISFET has a first gate insulating film arranged over the semiconductor substrate, a first gate electrode arranged over the first gate insulating film, and a first source region and a first drain region. The second MISFET has a second gate insulating film arranged over the semiconductor substrate, a second gate electrode arranged over the second gate insulating film, and a second source region and a second drain region. The first and the second gate electrode are electrically coupled, the first and the second source region are electrically coupled, and the first and the second drain region are electrically coupled. Accordingly, the first and the second MISFET are coupled in parallel. In addition, threshold voltages are different between the first and the second MISFET.
Public/Granted literature
- US20090194823A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-08-06
Information query
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