Invention Grant
US07989731B2 Method for processing materials with laser pulses having a large spectral bandwidth
有权
用具有大光谱带宽的激光脉冲处理材料的方法
- Patent Title: Method for processing materials with laser pulses having a large spectral bandwidth
- Patent Title (中): 用具有大光谱带宽的激光脉冲处理材料的方法
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Application No.: US10565582Application Date: 2004-07-20
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Publication No.: US07989731B2Publication Date: 2011-08-02
- Inventor: Mark Bischoff , Martin Hacker , Roland Sauerbrey , Gregor Stobrawa , Wolfgang Ziegler
- Applicant: Mark Bischoff , Martin Hacker , Roland Sauerbrey , Gregor Stobrawa , Wolfgang Ziegler
- Applicant Address: DE Jena
- Assignee: Carl Zeiss Meditec AG
- Current Assignee: Carl Zeiss Meditec AG
- Current Assignee Address: DE Jena
- Agency: Patterson Thuente Christensen Pedersen P.A.
- Priority: DE10333770 20030722
- International Application: PCT/EP2004/008090 WO 20040720
- International Announcement: WO2005/009666 WO 20050203
- Main IPC: B23K26/06
- IPC: B23K26/06

Abstract:
A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.
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