Invention Grant
- Patent Title: Electronic prototyping enclosure
- Patent Title (中): 电子原型机箱
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Application No.: US12455071Application Date: 2009-05-29
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Publication No.: US07989712B2Publication Date: 2011-08-02
- Inventor: Eric K. D. Chan
- Applicant: Eric K. D. Chan
- Agent David W. Wong
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.
Public/Granted literature
- US20100300747A1 Electronic prototyping enclosure Public/Granted day:2010-12-02
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