Invention Grant
- Patent Title: Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate
- Patent Title (中): 具有电连接位置的柔性片通过刚性衬底中的孔接合
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Application No.: US12393152Application Date: 2009-02-26
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Publication No.: US07989709B2Publication Date: 2011-08-02
- Inventor: Chang-Wei Tsao
- Applicant: Chang-Wei Tsao
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Steven M. Reiss
- Priority: CN200810304860 20081010
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01R12/00

Abstract:
A flexible printed circuit board includes a flexible sheet and a rigid substrate attached to the flexible printed circuit board. The flexible printed circuit board includes a first surface and an opposite second surface. A number of electrical connecting locations are defined on the first surface of the flexible printed circuit. The rigid substrate includes a third surface and an opposite fourth surface and is disposed on the flexible sheet with the fourth surface contacting the first surface of flexible sheet. The rigid substrate defines a number of through holes corresponding to the electrical connecting location to allow the electronic components to pass through.
Public/Granted literature
- US20100091468A1 FLEXIBLE PRINTED CIRCUIT BOARD FOR USE IN SURFACE-MOUNT TECHNOLOGY Public/Granted day:2010-04-15
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