Invention Grant
US07989709B2 Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate 有权
具有电连接位置的柔性片通过刚性衬底中的孔接合

  • Patent Title: Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate
  • Patent Title (中): 具有电连接位置的柔性片通过刚性衬底中的孔接合
  • Application No.: US12393152
    Application Date: 2009-02-26
  • Publication No.: US07989709B2
    Publication Date: 2011-08-02
  • Inventor: Chang-Wei Tsao
  • Applicant: Chang-Wei Tsao
  • Applicant Address: TW Tu-Cheng, New Taipei
  • Assignee: Chi Mei Communication Systems, Inc.
  • Current Assignee: Chi Mei Communication Systems, Inc.
  • Current Assignee Address: TW Tu-Cheng, New Taipei
  • Agent Steven M. Reiss
  • Priority: CN200810304860 20081010
  • Main IPC: H05K1/00
  • IPC: H05K1/00 H01R12/00
Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate
Abstract:
A flexible printed circuit board includes a flexible sheet and a rigid substrate attached to the flexible printed circuit board. The flexible printed circuit board includes a first surface and an opposite second surface. A number of electrical connecting locations are defined on the first surface of the flexible printed circuit. The rigid substrate includes a third surface and an opposite fourth surface and is disposed on the flexible sheet with the fourth surface contacting the first surface of flexible sheet. The rigid substrate defines a number of through holes corresponding to the electrical connecting location to allow the electronic components to pass through.
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