Invention Grant
US07989706B2 Circuit board with embedded component and method of manufacturing same 有权
具有嵌入式元件的电路板及其制造方法

Circuit board with embedded component and method of manufacturing same
Abstract:
A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole extends through the substrate or prepreg on which the electronic component is mounted inside the circuit board. Conductors in the via holes enable a terminal on the surface of the electronic component to be electrically connected to a wiring pattern or another electronic component on the opposite side of the substrate or prepreg. Routing the connection through the electronic component itself saves space and reduces the length of the connection.
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