Invention Grant
US07989706B2 Circuit board with embedded component and method of manufacturing same
有权
具有嵌入式元件的电路板及其制造方法
- Patent Title: Circuit board with embedded component and method of manufacturing same
- Patent Title (中): 具有嵌入式元件的电路板及其制造方法
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Application No.: US11273339Application Date: 2005-11-15
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Publication No.: US07989706B2Publication Date: 2011-08-02
- Inventor: Yoshinori Shizuno
- Applicant: Yoshinori Shizuno
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, PLLC
- Priority: JP2004-336264 20041119
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K3/20 ; H05K3/30 ; H05K1/16 ; H05K1/11 ; H05K7/00 ; H05K1/18 ; H01K3/10

Abstract:
A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole extends through the substrate or prepreg on which the electronic component is mounted inside the circuit board. Conductors in the via holes enable a terminal on the surface of the electronic component to be electrically connected to a wiring pattern or another electronic component on the opposite side of the substrate or prepreg. Routing the connection through the electronic component itself saves space and reduces the length of the connection.
Public/Granted literature
- US20060108144A1 Circuit board with embedded component and method of manufacturing same Public/Granted day:2006-05-25
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