Invention Grant
US07989359B2 Semiconductor module manufacturing method, semiconductor module, and mobile device
有权
半导体模块制造方法，半导体模块和移动设备
- Patent Title: Semiconductor module manufacturing method, semiconductor module, and mobile device
- Patent Title (中): 半导体模块制造方法，半导体模块和移动设备
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Application No.: US12022812Application Date: 2008-01-30
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Publication No.: US07989359B2Publication Date: 2011-08-02
- Inventor: Yoshio Okayama , Yasuyuki Yanase
- Applicant: Yoshio Okayama , Yasuyuki Yanase
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2007-020657 20070131; JP2008-012240 20080123
- Main IPC: H01L21/31
- IPC: H01L21/31
Abstract:
A semiconductor substrate having on its surface an electrode of a semiconductor device and a pattern unit is prepared. A copper plate is formed provided with a first principle surface having a bump and a second principle surface, opposite to the first principle surface, having a trench. By adjusting the position of the copper plate so that a pattern unit and the corresponding trench have a predetermined positional relation, the bump and the electrode are aligned, the first principle surface of the copper plate and a semiconductor substrate are pressure-bonded via an insulating layer, and the bump and the electrode become connected electrically while the bump penetrating the insulating layer. A predetermined rewiring pattern is formed on the side of the second principle surface.
Public/Granted literature
- US20080284012A1 SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AND MOBILE DEVICE Public/Granted day:2008-11-20
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