Invention Grant
- Patent Title: Method of creating an alignment mark on a substrate and substrate
- Patent Title (中): 在基板和基板上产生对准标记的方法
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Application No.: US12345113Application Date: 2008-12-29
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Publication No.: US07989303B2Publication Date: 2011-08-02
- Inventor: Richard Johannes Franciscus Van Haren
- Applicant: Richard Johannes Franciscus Van Haren
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
In an embodiment, a method of creating an alignment mark on a substrate includes forming a plurality of lines segmented into electrically conducting line segments and space segments, thereby forming spaces between the lines to form a macroscopic structure in a first layer of the substrate, creating a plurality of electrically conducting trenches in a second layer of the substrate, and arranging the plurality of trenches to be in electrical contact with the line segments and overlapping the space segments at least partially.
Public/Granted literature
- US20090166899A1 Method of Creating an Alignment Mark on a Substrate and Substrate Public/Granted day:2009-07-02
Information query
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