Invention Grant
- Patent Title: Transistor constructions and processing methods
- Patent Title (中): 晶体管结构和加工方法
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Application No.: US12841392Application Date: 2010-07-22
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Publication No.: US07989288B2Publication Date: 2011-08-02
- Inventor: Seiichi Aritome
- Applicant: Seiichi Aritome
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/8247
- IPC: H01L21/8247

Abstract:
A transistor construction includes a first floating gate having a first conductive or semiconductive surface and a second floating gate having a second conductive or semiconductive surface. A dielectric region is circumferentially surrounded by the first surface. The region is configured to reduce capacitive coupling between the first and second surfaces. Another transistor construction includes a floating gate having a cavity extending completely through the floating gate from a first surface of the floating gate to an opposing second surface of the floating gate. The floating gate otherwise encloses the cavity, which is filled with at least one dielectric. A method includes closing an upper portion of an opening in insulator material with a gate material during the deposition before filling a lower portion with the gate material. The depositing and closing provide an enclosed cavity within the lower portion of the opening.
Public/Granted literature
- US20100291766A1 Transistor Constructions and Processing Methods Public/Granted day:2010-11-18
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