Invention Grant
US07989282B2 Structure and method for latchup improvement using through wafer via latchup guard ring
有权
用于通过闭锁保护环通过晶片的闩锁改进的结构和方法
- Patent Title: Structure and method for latchup improvement using through wafer via latchup guard ring
- Patent Title (中): 用于通过闭锁保护环通过晶片的闩锁改进的结构和方法
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Application No.: US12411624Application Date: 2009-03-26
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Publication No.: US07989282B2Publication Date: 2011-08-02
- Inventor: Steven H. Voldman
- Applicant: Steven H. Voldman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony J. Canale
- Main IPC: H01L21/8238
- IPC: H01L21/8238
Abstract:
A method and structure for preventing latchup. The structure includes a latchup sensitive structure and a through wafer via structure bounding the latch-up sensitive structure to prevent parasitic carriers from being injected into the latch-up sensitive structure.
Public/Granted literature
- US20100244179A1 STRUCTURE AND METHOD FOR LATCHUP IMPROVEMENT USING THROUGH WAFER VIA LATCHUP GUARD RING Public/Granted day:2010-09-30
Information query
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