Invention Grant
- Patent Title: Package method of micro-electro-mechanical system chip
- Patent Title (中): 微机电系统芯片封装方法
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Application No.: US12557805Application Date: 2009-09-11
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Publication No.: US07989246B2Publication Date: 2011-08-02
- Inventor: Chuan-Wei Wang
- Applicant: Chuan-Wei Wang
- Applicant Address: TW Hsin-Chu
- Assignee: PixArt Imaging Incorporation
- Current Assignee: PixArt Imaging Incorporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/30 ; H01L21/302
Abstract:
The present invention proposes a MEMS chip and a package method thereof. The package method comprises; making a capping wafer by: providing a first substrate and forming an etch stop layer on the first substrate; making a device wafer by: providing a second substrate and forming a MEMS device and a material layer surrounding the MEMS device on the second substrate; bonding the capping wafer and the device wafer; after bonding, etching the first substrate to form at least one via; etching the etch stop layer through the via; etch the material layer; and forming a sealing layer on the first substrate.
Public/Granted literature
- US20110062532A1 MEMS Chip And Package Method Thereof Public/Granted day:2011-03-17
Information query
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