Invention Grant
- Patent Title: Mold core and method for fabricating mold core
- Patent Title (中): 模具芯和制造模芯的方法
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Application No.: US12541664Application Date: 2009-08-14
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Publication No.: US07989149B2Publication Date: 2011-08-02
- Inventor: Sei-Ping Louh
- Applicant: Sei-Ping Louh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Raymond J. Chew
- Priority: CN200810306572 20081227
- Main IPC: G03F7/20
- IPC: G03F7/20 ; B29C33/38

Abstract:
An exemplary method for fabricating a mold core includes the following steps. First, an ultraviolet (UV) transmitting glass substrate is provided. Second, a photo resist layer is formed on the substrate. Third, the photo resist layer is exposed under a UV light and developed to form a plurality of spaced through holes therein. Fourth, the areas of the surface of the substrate under the through holes are etched to form a plurality of cavities. Fifth, each cavity is filled with a light-curable material, and the photo resist layer is removed. Sixth, the light-curable material is solidified to form a light-cured material block in each cavity. Lastly, the light-cured material block in each cavity is machined using an ultra-precision machine to form a molding surface of the light-cured material block. Thereby, the mold core with a plurality of the molding surfaces is obtained.
Public/Granted literature
- US20100163708A1 MOLD CORE AND METHOD FOR FABRICATING MOLD CORE Public/Granted day:2010-07-01
Information query
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