A method for producing a patterned material for electronic or photonic circuits, comprising the steps of: p) providing a substrate; q) coating the substrate with a polymer layer; r) coating a thermal resist solution over the polymer layer to form a thermal resist layer, wherein the polymer layer is substantially immiscible in the thermal resist solution; s) exposing predetermined areas of the thermal resist layer, corresponding to a desired image pattern, using infrared light; t) removing portions of the thermal resist layer corresponding to a desired image pattern, using a developer; u) removing the polymer layer where the thermal resist layer has been previously removed and undercutting a portion of the remaining thermal resist layer by an etching process; v) depositing a material using a substantially anisotropic process; and removing the remaining thermal resist layer and any overlying material with a solvent for the polymer or thermal resist layers leaving the material in a desired pattern.