Invention Grant
- Patent Title: Epitaxial silicon wafer and fabrication method thereof
- Patent Title (中): 外延硅晶片及其制造方法
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Application No.: US11850591Application Date: 2007-09-05
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Publication No.: US07989073B2Publication Date: 2011-08-02
- Inventor: Takayuki Dohi , Shinji Nakahara , Masaya Sakurai , Masato Sakai
- Applicant: Takayuki Dohi , Shinji Nakahara , Masaya Sakurai , Masato Sakai
- Applicant Address: JP
- Assignee: Sumco Corporation
- Current Assignee: Sumco Corporation
- Current Assignee Address: JP
- Agency: Kolisch Hartwell, P.C.
- Priority: JP2006-240866 20060905; JP2007-228717 20070904
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
An epitaxial silicon wafer is provided in which an epitaxial layer is grown on a silicon wafer having a plane inclined from a {110} plane of a silicon single crystal as a main surface. In the silicon wafer for growing the epitaxial layer thereon, an inclination angle azimuth of the {110} plane is in the range of 0 to 45 degrees as measured from a orientation parallel to the {110} plane toward a direction. With such an arrangement, LPDs of 100 nm or less can be measured from a {110} wafer that has a carrier mobility (including the hole and electron mobilities) higher than that of a {100 } wafer. Also, surface roughness degradation in the {110} wafer can be suppressed. Also, the surface state of the {110} wafer can be measured. Further, a quality evaluation can be performed on the {110} wafer.
Public/Granted literature
- US20080057323A1 EPITAXIAL SILICON WAFER AND FABRICATION METHOD THEREOF Public/Granted day:2008-03-06
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