Invention Grant
- Patent Title: Flexible base for manufacturing flexible printed circuit boards
- Patent Title (中): 柔性基板制造柔性印刷电路板
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Application No.: US11960659Application Date: 2007-12-19
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Publication No.: US07989048B2Publication Date: 2011-08-02
- Inventor: Tso-Hung Yeh , Chia-Cheng Chen , Pei-Yu Chao
- Applicant: Tso-Hung Yeh , Chia-Cheng Chen , Pei-Yu Chao
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Foxconn Advanced Technology Inc.
- Current Assignee: Foxconn Advanced Technology Inc.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agent Jeffrey T. Knapp
- Priority: CN200710076393 20070704
- Main IPC: B32B3/24
- IPC: B32B3/24 ; H01L23/48

Abstract:
A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.
Public/Granted literature
- US20090011186A1 FLEXIBLE BASE FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS Public/Granted day:2009-01-08
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