Invention Grant
- Patent Title: Filler metal alloy compositions
- Patent Title (中): 填料金属合金组成
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Application No.: US12709548Application Date: 2010-02-22
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Publication No.: US07988908B2Publication Date: 2011-08-02
- Inventor: Dong Ha Lee , Jae Jung Park , Chung Yun Kang , Myoung Bok Kim
- Applicant: Dong Ha Lee , Jae Jung Park , Chung Yun Kang , Myoung Bok Kim
- Applicant Address: KR Pyeongtaek-si, Gyeonggi-do
- Assignee: Korea Bundy Co., Ltd.
- Current Assignee: Korea Bundy Co., Ltd.
- Current Assignee Address: KR Pyeongtaek-si, Gyeonggi-do
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2009-0084665 20090908
- Main IPC: C22C30/02
- IPC: C22C30/02 ; C22C30/04 ; C22C30/00

Abstract:
Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
Public/Granted literature
- US20110058980A1 FILLER METAL ALLOY COMPOSITIONS Public/Granted day:2011-03-10
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