Invention Grant
- Patent Title: Stamper and method for making soft mold
- Patent Title (中): 压模和制作软模的方法
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Application No.: US12492153Application Date: 2009-06-26
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Publication No.: US07988899B2Publication Date: 2011-08-02
- Inventor: Sei-Ping Louh
- Applicant: Sei-Ping Louh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Raymond J. Chew
- Priority: CN200810305893 20081201
- Main IPC: B29C57/00
- IPC: B29C57/00

Abstract:
An exemplary method for making a soft mold is provided. A transparent substrate is provided. A to-be-solidified film is formed on the transparent substrate. A stamper and a guiding plate are further provided. The guiding plate is positioned between the stamper and the to-be-solidified film. The stamper inserts one of the through holes of the guiding plate. The first alignment mark is aligned with one of the second alignment marks. The stamper is pressed into the to-be-solidified film. The pressed portion of the to-be-solidified film is solidified to obtain a second molding surface on the to-be-solidified film. The previous steps are repeated for the stamper and the rest of the through holes of the guiding plate to obtain a soft mold having a plurality of the second molding surfaces.
Public/Granted literature
- US20100136154A1 STAMPER AND METHOD FOR MAKING SOFT MOLD Public/Granted day:2010-06-03
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