Invention Grant
US07988888B2 Conductive pattern forming ink, conductive pattern, and wiring substrate
有权
导电图案形成油墨,导电图案和布线基板
- Patent Title: Conductive pattern forming ink, conductive pattern, and wiring substrate
- Patent Title (中): 导电图案形成油墨,导电图案和布线基板
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Application No.: US12326702Application Date: 2008-12-02
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Publication No.: US07988888B2Publication Date: 2011-08-02
- Inventor: Naoyuki Toyoda
- Applicant: Naoyuki Toyoda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2007-319018 20071210
- Main IPC: H01B1/20
- IPC: H01B1/20

Abstract:
A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; galactitol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.10 to 0.60; H = OH ( A ) Mw ( A ) X ( A ) + OH ( B ) Mw ( B ) X ( B ) Formula ( I ) where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl groups in one molecule of the galactitol, Mw(B) represents a molecular weight of the galactitol, and X(B) represents a content of the galactitol in the conductive pattern forming ink in weight percent.
Public/Granted literature
- US20090145639A1 CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE Public/Granted day:2009-06-11
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