Invention Grant
- Patent Title: Device for liquid treatment of wafer-shaped articles
- Patent Title (中): 晶片状物品的液体处理装置
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Application No.: US11584652Application Date: 2006-10-23
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Publication No.: US07988818B2Publication Date: 2011-08-02
- Inventor: Philipp Engesser
- Applicant: Philipp Engesser
- Applicant Address: AT Villach
- Assignee: Lam Research AG
- Current Assignee: Lam Research AG
- Current Assignee Address: AT Villach
- Agency: Young & Thompson
- Priority: EP00123714 20001031
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/304 ; G03F7/00
Abstract:
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary force.
Public/Granted literature
- US20070084561A1 Device for liquid treatment of wafer-shaped articles Public/Granted day:2007-04-19
Information query
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