A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.