Invention Grant
- Patent Title: Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
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Application No.: US12360869Application Date: 2009-01-28
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Publication No.: US07988807B2Publication Date: 2011-08-02
- Inventor: Kazuki Noda , Masaru Iwasawa
- Applicant: Kazuki Noda , Masaru Iwasawa
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Stephen F. Wolf
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
Public/Granted literature
- US20090133812A1 LAMINATE BODY, METHOD, AND APPARATUS FOR MANUFACTURING ULTRATHIN SUBSTRATE USING THE LAMINATE BODY Public/Granted day:2009-05-28
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