Invention Grant
- Patent Title: Percutaneous spinal implants and methods
- Patent Title (中): 经皮脊髓植入物和方法
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Application No.: US11356302Application Date: 2006-02-17
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Publication No.: US07988709B2Publication Date: 2011-08-02
- Inventor: Janna G. Clark , Andrew C. Kohm , Hugues F. Malandain
- Applicant: Janna G. Clark , Andrew C. Kohm , Hugues F. Malandain
- Applicant Address: CH Neuchatel
- Assignee: Kyphon Sarl
- Current Assignee: Kyphon Sarl
- Current Assignee Address: CH Neuchatel
- Main IPC: A61B17/58
- IPC: A61B17/58

Abstract:
Spinal implants and methods for the placement thereof are disclosed herein. In one variation, the implant includes a support member, a proximal retention member, and a distal retention member. The support member is configured to be disposed between adjacent spinous processes. The proximal retention member has a first configuration in which the proximal retention member is substantially disposed within a proximal portion of the support member, and a second configuration in which a portion of the proximal retention member is disposed outside of the support member. The distal retention member has a first configuration in which the distal retention member is substantially disposed within a distal portion of the support member, and a second configuration in which a portion of the distal retention member is disposed outside of the support member.
Public/Granted literature
- US20070225706A1 Percutaneous spinal implants and methods Public/Granted day:2007-09-27
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