Invention Grant
- Patent Title: Grinding method for grinding workpieces
- Patent Title (中): 研磨工件的研磨方法
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Application No.: US12178819Application Date: 2008-07-24
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Publication No.: US07988536B2Publication Date: 2011-08-02
- Inventor: Sei-Ping Louh
- Applicant: Sei-Ping Louh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Andrew C. Cheng
- Priority: CN200710203399 20071225
- Main IPC: B24B9/00
- IPC: B24B9/00

Abstract:
An exemplary grinding method includes, firstly, providing a holding device including a first rotatable pressing portion and a second rotatable pressing portion, and providing a base. Then a number of workpieces are placed into a groove of the base. Two blocking members identical in shape are placed in the groove, with the workpieces therebetween. The blocking members are moved towards the workpieces to closely align with the workpieces. The sizes of the blocking members are compared with that of each workpiece, and then the blocking members are removed. If the workpieces are larger than the blocking members, the workpieces are thereafter held between the first and second pressing portions. Next, the base is removed and the first and second pressing portions are driven to rotate. Subsequently, the workpieces are ground, and then a number of finished products are obtained.
Public/Granted literature
- US20090163125A1 GRINDING APPARATUS HAVING PRESSING PORTION AND GRINDING METHOD USING SAME Public/Granted day:2009-06-25
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