Invention Grant
- Patent Title: Electrical engagement structure of connection device
- Patent Title (中): 连接装置的电接合结构
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Application No.: US12862767Application Date: 2010-08-25
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Publication No.: US07988460B1Publication Date: 2011-08-02
- Inventor: Jeremy S. Chiu , Hsuan-Ho Chung
- Applicant: Jeremy S. Chiu , Hsuan-Ho Chung
- Applicant Address: TW Taipei
- Assignee: DNOVA Corporation
- Current Assignee: DNOVA Corporation
- Current Assignee Address: TW Taipei
- Agent Leong C. Lei
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A connection device includes an electrical engagement structure. The connection device includes a connector and a printed circuit board (PCB) based tongue. The PCB based tongue is received and retained in the connector and has a distal end extending toward an open-cavity plug receiving side of the connector in such a way that side edges of the tongue are spaced from corresponding inner walls of the connector. As such, the connector is made compatible to various buses through the PCB based tongue that include contacts that are selectively arranged to correspond to the buses.
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