Invention Grant
- Patent Title: Mold assembly
- Patent Title (中): 模具总成
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Application No.: US12542313Application Date: 2009-08-17
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Publication No.: US07988446B2Publication Date: 2011-08-02
- Inventor: Chin-Wen Yeh , Zhen-Neng Lin
- Applicant: Chin-Wen Yeh , Zhen-Neng Lin
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent D. Austin Bonderer
- Priority: CN200910302686 20090527
- Main IPC: B29C45/22
- IPC: B29C45/22

Abstract:
A mold assembly includes an upper mold cavity, a base plate, and a flow element. The upper mold cavity defines a primary runner and a plurality of sub-runners on a top surface in communication with the upper mold cavity. A gate is defined in the primary runner for injecting liquefied plastic into the upper mold cavity. The base plate defines an outlet thereon corresponding to the gate for outputting the liquefied plastic. The upper mold cavity and the base plate corporately form a closed cavity therebetween. The flow element is received in the closed cavity and movable between a first position and a second position. In the first position, the flow element is engaged with the primary runner and plurality of sub-runners. In the second position, the flow element is separated with the primary runner and plurality of sub-runners.
Public/Granted literature
- US20100303944A1 MOLD ASSEMBLY Public/Granted day:2010-12-02
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