A method for connecting an electronic chip (10) to contacts (47and 48) of an electric circuit, the chip having two conductive plates (31and 32) located on the last layer of the chip and at least one electromagnetic shielding layer, at least one of the plates (31or 32) being entirely covered with an electrical insulating layer (34). The method includes placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), to fix the electronic chip (10) relative to the circuit, positioning electronic chip (10) on the circuit so that conductive plates (31et 32) are opposite the contacts (47and 48), so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31or 32), the electrically insulating layer and the contact (47or 48).